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Institute of Photonic Technologies
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  1. Friedrich-Alexander-Universität
  2. Faculty of Engineering

Institute of Photonic Technologies

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Equipment

In page navigation: Research
  • Research Groups
    • Additive Manufacturing
    • Medical Photonics
    • Sensing, Control, Real-time Systems
    • Simulation and Modeling
    • Ultrashort Pulse Laser Technologies
  • Equipment
  • Publications
  • Patents

Equipment

Equipment

Machines:

  • Various industrial machines for different additive manufacturing processes:
    • Laser metal deposition (LMD)
    • Laser beam melting (LBM) of metals in powder bed.
  • 3D laser processing cell for multi-kw welding and cutting applications
  • Industrial robots and Multi-axis linear stages
  • Marking laser and marking system
  • 6-axis micromachining equipment with dynamic beam shaping unit
  • Multibeam interference processing station for nanostructuring

Beam Sources:

  • Several multi-kW disc lasers ≤8 kW
  • Several single mode fiber lasers ≤2 kW
  • Direct diode laser 4 kW (prototype)
  • KrF excimer laser >100W
  • Short pulsed CO2 and solid state laser with >300W power and ns pulse duration
  • Ultrashort pulsed lasers systems with <45W average power and  pulse durations from 100 fs to 10 ps

Complementary Equipment:

  • Metal cutting machine tools for post-processing in the area of Additive Manufacuring
  • Matching system technology:
    • Various processing optics partly with dynamic beam deflection
  • Equipment for beam characterization:
    • High-power beam profilers and beam profile cameras
    • Wavefront sensors, power meters, auto-correlators etc.

Measuring and Diagnostic Systems:

  • SEM with EBSD- and EDX/WDS analytics.
  • High-speed cameras with up to 1 MHz acquisition rate.
  • Thermal camera und pyrometers
  • 3D-Laserscanning microscope
  • Micro-hardness analyzer
  • Meters to measure infrared absorption

Clinical Photonics Lab:

  • UV-VIS-IR spectrometer, spectrophotometer, spectrofluorometer
  • High-resolution OCT system
  • Workspace according to security level S1 (and S2 if required)

Materialographic Laboratory:

  • Sample preparation systems
    • Cutting preparation (angle grinder, diamond wire saw, vibratome, microtome)
    • Additional equipment for various embedding and etching processes
    • Fully and semiautomatic grinding and polishing systems
  • Various optical microscopes for microsection analysis
    • Brightfield, darkfield, differential interference contrast




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